Spring adapted to hold electronic device in a frame

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080200, C165S185000, C257S718000, C257S719000, C361S710000, C361S719000

Reexamination Certificate

active

07859847

ABSTRACT:
An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.

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Translation of First Office Action in JP 2005369369 dated Nov. 18, 2008.
Translation of Second Office Action in JP 2005369369 dated Feb. 9, 2010.

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