Electric heating – Metal heating – By arc
Reexamination Certificate
2007-03-06
2007-03-06
Heinrich, Samuel M. (Department: 1725)
Electric heating
Metal heating
By arc
C438S106000
Reexamination Certificate
active
10685818
ABSTRACT:
A sprayable adhesive composition having a viscosity within the range of 0.5 Pa.s to 5.0 Pa.s, containing at least one colored filler present in an amount up to 50% by weight of the adhesive composition, is suitable for marking identifications or fiducials on semiconductor dies or wafers. The preferred resins include epoxy resins or combinations of an electron donor resin and an electron acceptor resin.
REFERENCES:
patent: 4061820 (1977-12-01), Magid et al.
patent: 4344006 (1982-08-01), Mendelsohn
patent: 5641997 (1997-06-01), Ohta et al.
patent: 6175162 (2001-01-01), Kao et al.
patent: 6177093 (2001-01-01), Lombardi et al.
patent: 6432796 (2002-08-01), Peterson
patent: 6524881 (2003-02-01), Tandy et al.
patent: 6824849 (2004-11-01), Herzog et al.
patent: 2001/0035588 (2001-11-01), Aga
patent: 2002/0096491 (2002-07-01), Tandy et al.
patent: 2003/0189814 (2003-10-01), Kato et al.
patent: 0 590975 (1994-06-01), None
patent: 359175751 (1984-10-01), None
patent: 62005885 (1987-01-01), None
patent: 402130947 (1990-05-01), None
patent: 403093240 (1991-04-01), None
patent: 06045414 (1994-02-01), None
patent: 407304251 (1995-11-01), None
patent: 408132258 (1996-05-01), None
patent: 409277700 (1997-10-01), None
patent: 02000075794 (2000-03-01), None
He Xiping
Tomaso Torey
Gennaro Jane E.
Heinrich Samuel M.
National Starch and Chemical Investment Holding Corporation
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