Etching a substrate: processes – Nongaseous phase etching of substrate
Patent
1998-02-12
1999-09-14
Utech, Benjamin
Etching a substrate: processes
Nongaseous phase etching of substrate
239490, 2395332, B05D 500, B05B 134
Patent
active
059518820
ABSTRACT:
A method of forming an atomizing spray nozzle includes the steps of etching a swirl chamber and a spray orifice in a thin sheet of material. The swirl chamber is etched in a first side of the disk and the spray orifice is etched through a second side to the center of the swirl chamber. Feed slots are etched in the first side of the disk extending non-radially to the swirl chamber such that liquid can be conveyed to the swirl chamber so as to create and sustain the swirling motion. A inlet piece with inlet passage therein is connected with first side of the disk so as to convey liquid to the feed slots of the disk and to enclose the feed slots and swirl chamber. In addition to the method described an atomizing spray nozzle having the configuration described is much improved in its spray characteristics. The present invention also provides a method of forming a number of spray nozzles simultaneously in a single manufacturing process.
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Printed material by Harold C. Simmons entitled "Initial Spray Formation in Simplex Swirl-Atomizers (Fuel Nozzles)" presented at a conference on Jun. 20-24, 1982 at the Concourse Hotel in Madison, Wisconsin.
Harvey Rex J.
Simmons Harold C.
Champagne Donald L.
Hunter Christopher H.
Parker Intangibles Inc.
Utech Benjamin
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