Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Patent
1993-09-30
1995-07-25
Dang, Thi
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
216 92, 216 48, B05D 500
Patent
active
054358841
ABSTRACT:
A method of forming an atomizing spray nozzle includes the steps of etching a swirl chamber and a spray orifice in a thin sheet of material. The swirl chamber is etched in a first side of the disk and the spray orifice is etched through a second side to the center of the swirl chamber. Feed slots are etched in the first side of the disk extending non-radially to the swirl chamber such that liquid can be conveyed to the swirl chamber so as to create and sustain the swirling motion. A inlet piece with inlet passage therein is connected with first side of the disk so as to convey liquid to the feed slots of the disk and to enclose the feed slots and swirl chamber. In addition to the method described an atomizing spray nozzle having the configuration described is much improved in its spray characteristics. The present invention also provides a method of forming a number of spray nozzles simultaneously in a single manufacturing process.
REFERENCES:
patent: 4357196 (1982-11-01), Tanaka et al.
patent: 4733823 (1988-03-01), Waggener et al.
Harvey Rex. J.
Simmons Harold C.
Dang Thi
Morgan Christopher H.
Parker-Hannifin Corporation
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