Spray etching apparatus with automatic individually controllable

Details Spray etching apparatus with automatic individually controllable Spray etching apparatus with automatic individually controllable

1989-08-07

1991-03-26

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156626, 156627, 156640, 134 57R, 134113, H01L 21306, C23F 102

Patent

active

050026275

ABSTRACT:
The invention concerns a method of etching an etch material consisting at least partly of metal and an arrangement for implementing that method. According to the invention, the etchant is applied through jet assemblies arranged perpendicularly to each other on the top and the bottom side of the etch material. During the passage of the etch material, the spray pressure at the jet assemblies or the jets may be set to constant values and/or by individually controlled as a function of the quantity of metal to be etched off the top and the bottom side. The invention is particularly suitable for etching circuit boards, whose conductors on the top and the bottom side are arranged perpendicularly to each other.

REFERENCES:
patent: 3788912 (1974-01-01), Frantzen
patent: 4741798 (1988-05-01), Haas
Adjustable Nozzles for Spray Etchers, Heilemann et al., IBM Technical Disclosure Bulletin, vol. 13, No. 12, May 1971.

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