Spray cooled module with removable spray cooled sub-module

Details Spray cooled module with removable spray cooled sub-module Spray cooled module with removable spray cooled sub-module

1998-10-14

1999-12-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361689, 361696, 361698, 361701, 361704, 174 151, 165 804, 16510433, H05K 720

Patent

active

059994045

ABSTRACT:
An electronic system that may include an electronic card sub-module that is electrically connected to, and in fluid communication with, an electronic card module. The electronic card module can be mated with a motherboard and coupled to a manifold of a cooling system that provides a cooling fluid to the modules. The cooling fluid can flow directly onto integrated circuits or integrated circuit packages located within the modules. Each module may have an electrical connector and a fluid connector that allows the sub-module to be plugged into the module, and the module to be plugged into the motherboard and manifold without using any tools or hardware.

REFERENCES:
patent: 5131859 (1992-07-01), Bowen et al.
patent: 5424916 (1995-06-01), Martin
patent: 5646824 (1997-07-01), Ohashi et al.
patent: 5870284 (1999-02-01), Stewart et al.
patent: 5870823 (1999-02-01), Bezama et al.

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