Spray cell for selective metal deposition or removal

Details Spray cell for selective metal deposition or removal Spray cell for selective metal deposition or removal

1979-10-01

1980-10-21

Prescott, Arthur C.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204 43G, 204206, 204224R, 204 15, C25C 120, C25C 700

Patent

active

042292697

ABSTRACT:
A spray plating method is shown wherein a multiplicity of spray nozzles mounted on a feed pipe direct a high velocity spray at an article to be plated. The spray is deflected onto portions of the article by metal deflectors located near the article. The deflectors serve as the anode of the plating process. This results in a high current density and a high plating rate. The method is advantageously used for hard plating gold onto connector pins or other articles on a continuous strip-plating line. In another application, metal may be selectively removed from an article. Different portions of an article may have different amounts of metal deposited or removed.

REFERENCES:
patent: 3414501 (1968-12-01), Kruger
patent: 3657097 (1972-04-01), Baldock et al.
patent: 3810829 (1974-05-01), Oliver
patent: 4001093 (1977-01-01), Koontz et al.
patent: 4029555 (1977-06-01), Tezuka et al.
patent: 4032414 (1977-06-01), Helder et al.
patent: 4033833 (1977-07-01), Bestel et al.
patent: 4069126 (1978-01-01), Abei
patent: 4162952 (1979-07-01), Tribout

Affiliated with

Also associated with

Rating

Spray cell for selective metal deposition or removal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Spray cell for selective metal deposition or removal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Spray cell for selective metal deposition or removal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2021716