Split-cross-bridge resistor for testing for proper fabrication o

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324 65R, G01R 3100, G01R 2702

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045160716

ABSTRACT:
An electrical testing structure and method whereby a test structure is fabricated on, e.g., a large scale integrated circuit wafer along with the circuit components and has a van der Pauw cross resistor in conjunction with a bridge resistor and a split bridge resistor, the latter having two channels each a line width wide, corresponding to the line width of the wafer circuit components, and with the two channels separated by a space equal to the line spacing of the wafer circuit components. The testing structure has associated voltage and current contact pads arranged in a two by four array for conveniently passing currents through the test structure and measuring voltages at appropriate points to calculate the sheet resistance, line width, line spacing, and line pitch of the circuit components on the wafer electrically.

REFERENCES:
patent: 4347479 (1982-08-01), Cullet
Hall, Resistance Calculations for Thin Film Patterns, Thin Solid Film, vol. 1, at 277-295, (1967-1968).
Van der Pauw, a Method of Measuring Specific Resistivity and Hall Effect of Discs of Arbitrary shape, Philips Res. Repts., vol. 13, No. 1, at 1-9, (Feb. 1958).
Von der Pauw, A Method of Measuring the Resistivity and Hall Coeficient on Lamellae of Arbitrary Shape, Philips Technical Review, vol. 20 at 220-224.
Buehler, Comprehensive Test Patterns with Modular Test Structures, the 2 by N Probe-Pad Array Approach, Solid State Technology, Oct. 1979, at 89-94.
Buehler, Grant, Thurber, Bridge and Van der Pauw, Sheet Resistors for Characterizing the Line Width of Conducting Layers, J. Electroclem Soc., vol. 125, No. 4, at 650-654, (1978).
David and Buehler, A Numerical Analysis of Various Cross Sheet Resistor Test Structures, Solid State Electronics., vol. 20, pp. 539-543, (1977).

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