Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-02-14
1999-06-22
Engel, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156159, 156361, 156502, 156505, 2425551, 226 22, B65H 2300, B32B 3100
Patent
active
059139919
ABSTRACT:
A splicing method comprising the steps of: (a) holding a first tape on a first tape guiding portion and a second tape guiding portion which are positioned in alignment with each other; (b) cutting the first tape between the first tape guiding portion and the second tape guiding portion so as to allow a first end portion held on the first tape guiding portion and a second end portion held on the second tape guiding portion to be formed in the first tape; and (c) splicing one of the first end portion and the second end portion to a second tape, wherein a step (d) of detecting whether or not at least one of a portion of the first tape being held on the first tape guiding portion and a portion of the first tape being held on the second tape guiding portion is in a predetermined holding position is effected prior to step (c), and when the at least one is in the predetermined holding position, step (c) is effected. Accordingly, it is possible to dispense with inspection of an acceptable or unacceptable state of spliced portions of the first tape and the second tape.
REFERENCES:
patent: 3879246 (1975-04-01), Walker
patent: 4003511 (1977-01-01), Schwestka
patent: 4501630 (1985-02-01), Kiuchi
patent: 4878986 (1989-11-01), Nishikawa
Komai Hirokazu
Kubota Kazuo
Engel James
Fuji Photo Film Co. , Ltd.
LandOfFree
Splicing device and splicing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Splicing device and splicing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Splicing device and splicing method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1706134