Spiral strip brushlike stress buffering power semiconductor cont

Details Spiral strip brushlike stress buffering power semiconductor cont Spiral strip brushlike stress buffering power semiconductor cont

1980-08-29

1983-09-27

Larkins, William D.

Spring devices

Vehicle

Lever and nontorsion spring

267181, 357 65, 357 79, 357 81, H01L 2304, H01L 2348

Patent

active

044070063

ABSTRACT:
A large area semiconductor disk, wherein in order to be able to connect, for example, by soldering, welding or diffusion-bonding the semiconductor disk with copper disks serving for the heat conduction and for the current supply, a copper tape wound to form a spiral is used to make the connection between the two disks. Transverse slots are etched or punched into the copper tape so that free V-shaped crosspieces are formed on one side. The ends of the cross-pieces are connected with the silicon disk, and measures are taken so that the crosspieces do not connect with each other. The other side of the wound tape is soldered to the copper disk. The radial thermal expansion differences between the copper disk and silicon disks, as well as the axial thermal expansion differences between the silicon disk and the casing, as well as production tolerances in the planeness of the copper and silicon disks are absorbed elastically by the corresponding V-shape of the crosspieces.

REFERENCES:
patent: 2927953 (1960-03-01), Staller
patent: 3128419 (1964-04-01), Walkoetter et al.
patent: 3273029 (1966-09-01), Ross
patent: 3296501 (1967-01-01), Moore
patent: 3387191 (1968-06-01), Fishman et al.
patent: 4196442 (1980-04-01), Kuniya et al.
patent: 4290800 (1981-09-01), Hysell et al.
patent: 4315591 (1982-02-01), Houston
patent: 4333102 (1982-06-01), Jester et al.

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