Spinner chuck

Chucks or sockets – Vacuum

Patent

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Details

51235, 264DIG78, 269 21, B23B 3130

Patent

active

046038671

ABSTRACT:
A vacuum spinner chuck having improved holding power for thin wafers is obtained by providing a retention means for moveably holding an O-ring on the peripheral edge of the chuck. There is a first part-circular portion adjacent the upper surface of the chuck, arranged so that in the absence of vacuum the O-ring protrudes above the chuck surface and contacts the wafer. Below this first part-circular portion is a second sloped portion which tilts away from the surface of the spinner chuck by an angle preferably in the range 30-60 degrees. There is a smooth transition between these two portions. When vacuum is applied to the space between the wafer and the chuck, the wafer presses on the O-ring causing it to stretch and move down from the part-circular portion onto the sloped portion until the wafer rests on the surface of the chuck. The stretch creates an opposing force which holds the O-ring in contact with the wafer and the spinner chuck to prevent loss of vacuum. The stretch automatically returns the O-ring to its initial position when the vacuum is removed. The holding power of the chuck is doubled.

REFERENCES:
patent: 2443987 (1948-06-01), Morrison et al.
patent: 2730370 (1956-01-01), Brewster
patent: 2955829 (1960-10-01), Brewster
patent: 3484093 (1969-12-01), Mermelstein
patent: 3730134 (1973-05-01), Kadi
patent: 4183545 (1980-01-01), Daly
patent: 4357006 (1982-11-01), Hayes
patent: 4420585 (1984-09-01), Bavelloni
patent: 4428815 (1984-01-01), Powell et al.

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