Spincup with a wafer backside deposition reduction apparatus

Details Spincup with a wafer backside deposition reduction apparatus Spincup with a wafer backside deposition reduction apparatus

1994-10-24

1996-06-25

Collins, Laura

Coating apparatus

Work holders, or handling devices

118 50, 118 52, 118 56, 118 58, 118 66, 118 69, 118319, 118320, 118501, 118730, B05C 1300

Patent

active

055296262

ABSTRACT:
A spincup having a wafer backside deposition reduction apparatus is used to reduce wafer backside particle deposition of materials on a wafer during processing. The spincup includes an opening for accommodating a wafer supporting chuck and a particle guard which circumscribes the chuck. The particle guard contacts the base of the spincup and circumscribes the chuck. When the chuck supports a wafer, a wafer backside region is defined between the chuck and the particle guard. The spincup further includes an exhaust channel coupled to the wafer backside region to independently exhaust the wafer backside region. In one embodiment, the exhaust channel includes an exhaust port for connecting a vacuum generator to the exhaust channel and a shroud contacting a base of the spincup and the particle guard. In another embodiment, the exhaust channel includes exhaust tubes which replace the exhaust manifold shroud and exhaust port.

REFERENCES:
patent: 4518078 (1985-05-01), Garrett
patent: 4685852 (1987-08-01), Rubin et al.
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5238499 (1993-08-01), van de Ven et al.
patent: 5292554 (1994-03-01), Sinha et al.
patent: 5315749 (1994-05-01), Nenadic et al.
patent: 5403397 (1995-04-01), Beckers et al.

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