Spin process for highly conformal coatings

Details Spin process for highly conformal coatings Spin process for highly conformal coatings

1996-06-28

1998-11-17

Bell, Janyce

Coating processes

Centrifugal force utilized

427162, 4273855, B05D 312

Patent

active

058373195

ABSTRACT:
A substrate is rotated at a first bead of less than or equal to 500 rpm per second. A coating composition solution is applied to the substrate at this point. The substrate is then accelerated at a first rate of between 300 and 1200 rpm per second. When the speed of the substrate reaches approximately 3000 rpm per second, a second acceleration is initiated at a second rate of greater than or equal to 3000 rpm. The coating composition is set and the substrate is decelerated. This process provides a more conformal coating of the composition providing better push-pull unwritten variability.

REFERENCES:
patent: 4175145 (1979-11-01), Fechter
patent: 4267212 (1981-05-01), Sakawaki
patent: 4353937 (1982-10-01), Chiba et al.
patent: 4551335 (1985-11-01), Ericson et al.
patent: 4587139 (1986-05-01), Hagan et al.
patent: 5080946 (1992-01-01), Takagisi et al.
patent: 5122435 (1992-06-01), Schmitt et al.
patent: 5188863 (1993-02-01), de Graaf
patent: 5199988 (1993-04-01), Kamezaki et al.
patent: 5405813 (1995-04-01), Rodrigues
patent: 5571560 (1996-11-01), Lin
"Mechanism for the Local Planarization of Microscopically Rough Surfaces by Drying Thin Films of Spin-Coated Polymer/Solvent Solutions", Journal of Electrochemical Society, vol. 137 (1990) (no date).
Principles of Optical Disc Systems, pp. 114 and 115 (no date).

Affiliated with

Also associated with

Rating

Spin process for highly conformal coatings does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Spin process for highly conformal coatings, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Spin process for highly conformal coatings will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-881893