Spin cleaning method

Details Spin cleaning method Spin cleaning method

1996-05-21

1999-03-16

Snay, Jeffrey

Cleaning and liquid contact with solids

Processes

Gas or vapor condensation or absorption on work

134 33, B08B 310

Patent

active

058824332

ABSTRACT:
At first, a semiconductor wafer is held and rotated by a spin chuck, and supplied with a hydrofluoric acid solution from a chemical liquid nozzle to remove natural oxide films on the wafer. Then, the wafer is supplied with pure water for rinsing it from a rinsing nozzle while the wafer is rotated. Right before the pure water stops being supplied, the wafer is supplied with an IPA liquid from a replacing medium nozzle while the wafer is rotated. The pure water is replaced with the IPA liquid by means of the Marangoni effect and a centrifugal force. Then, the wafer is rotated at 300 rpm for one second, at 3000 rpm for four seconds, and at 5000 rpm for five seconds, in this order, to remove the IPA liquid by means of a centrifugal force.

REFERENCES:
patent: 5271774 (1993-12-01), Leenaars et al.
patent: 5660642 (1997-08-01), Britten
patent: 5715612 (1998-02-01), Schwenkler

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