Spherical shaped semiconductor integrated circuit

Photocopying – Projection printing and copying cameras – Image transferred to or from curved surface

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Details

355 71, G03B 2752, G03B 2750

Patent

active

060696826

ABSTRACT:
A spherical shaped semiconductor integrated circuit ("ball") and a system and method for manufacturing same. The ball replaces the function of the flat, conventional chip. The physical dimensions of the ball allow it to adapt to many different manufacturing processes which otherwise could not be used. Furthermore, the assembly and mounting of the ball may facilitates efficient use of the semiconductor as well as circuit board space.

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patent: 5955776 (1999-09-01), Ishikawa

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