Spherical shaped semiconductor device, a flexible printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With specified crystal plane or axis

Reexamination Certificate

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C257S618000, C257S690000, C257S701000, C257S688000

Reexamination Certificate

active

07002237

ABSTRACT:
A spherical shaped semiconductor device has a protective insulating film thereon and input/output connection openings that are located along a intersected portion on the protective insulating film where a plane face running through a center of the spherical shaped semiconductor device intersects the protective insulating film. More input/output connection openings are provided on the spherical shaped semiconductor device compared with a conventional square semiconductor device. The spherical shaped semiconductor device is connected to a flat circuit substrate through a flexible printed wiring substrate. A lower portion of the flexible printed wiring substrate is cut into divided sections for connecting input/output terminals of the flat circuit substrate. Connection between the spherical shaped semiconductor device and the flat circuit substrate does not cause any cracks or disconnection due to flexibility of the flexible printed wiring substrate.

REFERENCES:
patent: 4806495 (1989-02-01), Levine
patent: 5028546 (1991-07-01), Hotchkiss
patent: 5877943 (1999-03-01), Ramamurthi
patent: 5945725 (1999-08-01), Ishikawa
patent: 5955776 (1999-09-01), Ishikawa
patent: 6004396 (1999-12-01), Ishikawa
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patent: WO98/15983 (1998-04-01), None
patent: WO 98/25090 (1998-06-01), None
Nikkei Microdevices No. 157 (Jul. 1, 1998).

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