Spherical particles of silica-containing compound oxide and...

Chemistry of inorganic compounds – Silicon or compound thereof – Oxygen containing

Reexamination Certificate

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C423S325000, C423S327100, C423S335000, C423S336000, C423S610000, C423S624000, C423S625000, C423S592100, C423S594120, C423S598000, C423S600000, C501S128000, C501S053000, C501S054000, C501S153000, C501S154000

Reexamination Certificate

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07615201

ABSTRACT:
By using a halogen-free siloxane and an organometallic compound containing at least one metal other than silicon as feed stocks, and simultaneously atomizing and burning them in a flame, spherical particles of silica-containing compound oxide are prepared which are substantially halogen-free, consist of 0.5-99% by weight of metal oxides and the balance of silica, and have a particle size of 10 nm to 3 μm. The particles are useful as a filler in epoxy resin base semiconductor sealants, a refractive index modifier or the like.

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Safety (MSDS) data for decamethylcyclopentasiloxane, octamethylcyclotetrasiloxane and hexamethylcyclotrisiloxane (no date).

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