Special surfaces for wire bonding

Details Special surfaces for wire bonding Special surfaces for wire bonding

1986-05-19

1988-08-30

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using high frequency vibratory energy

228206, 228179, 228203, 428612, 428687, B23K 2024, H01L 2188

Patent

active

047670495

ABSTRACT:
The present invention relates to a process for forming improved bonds between components of electrical or electronic devices. The process of the present invention preferably comprises annealing a metallic substrate to form a substantially uniform, substantially continuous oxide layer on a surface of the substrate, exposing the oxidized substrate to a reducing atmosphere so as to form an irregular surface on the substrate, and bonding another component to the irregular surface.

REFERENCES:
patent: 3107197 (1963-10-01), Stein et al.
patent: 3114683 (1963-12-01), Chorney
patent: 3228104 (1966-01-01), Emeis
patent: 3537175 (1967-10-01), St. Clair et al.
patent: 3662454 (1972-05-01), Miller
patent: 3684464 (1972-08-01), Happ et al.
patent: 3875652 (1975-04-01), Arnold et al.
patent: 3999955 (1976-12-01), Martin et al.
patent: 4027326 (1977-05-01), Kummer et al.
patent: 4358479 (1982-11-01), Canestaro et al.
patent: 4500605 (1985-02-01), Fister et al.
patent: 4552627 (1985-11-01), Parthasarathi
patent: 4566939 (1986-01-01), Miller et al.
patent: 4661417 (1987-04-01), Suzuki et al.

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