Spaced, bumped component structure

Details Spaced, bumped component structure Spaced, bumped component structure

2005-11-10

2010-02-23

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23021, C257SE23004, C257SE21511, C257S778000, C257S774000, C257S773000

Reexamination Certificate

active

07667323

ABSTRACT:
A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.

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