Wave transmission lines and networks – Coupling networks – With impedance matching
Patent
1990-06-22
1991-10-15
Gensler, Paul
Wave transmission lines and networks
Coupling networks
With impedance matching
333238, H01P 500
Patent
active
050577980
ABSTRACT:
A space-saving, two-sided microwave transmission line for hybrid circuits is disclosed, wherein a microstrip or coplanar waveguide RF line is formed on the front side and a microstrip or coplanar waveguid RF transmission line is formed on the backside of a hybrid circuit board containing other components. The RF line is formed on the top side of the circuit board to facilitate connections to other circuit boards and/or RF components, but is routed underneath the board to traverse the areas of the board occupied by other components. When the RF line is on the top side of the substrate, the groundplane is established by the metal layer on the bottom of the substrate for a microstrip line and by a top metal layer for a coplanar waveguide line, and when the RF line is on the bottom of the substrate, the groundplane is established with the metal layer on top of the substrate for a microstrip line, and with the bottom metal layer for a coplanar waveguide line. The connection from the topside and backside RF lines is accomplished by low VSWR plated via holes through the substrate.
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Moye Christopher A.
Owens Joseph N.
Alkov Leonard A.
Denson-Low Wanda K.
Gensler Paul
Hughes Aircraft Company
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