Space-saving insulation displacement type interconnect device fo

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

439406, 439493, 439499, H01R 909

Patent

active

051885360

ABSTRACT:
A surface mountable insulation displacement type connector for electrically coupling an end portion of a connector ribbon to a spaced series of surface mounted electrically conductive contact pads on a printed circuit board has an elongated base portion through which the central body sections of a longitudinally spaced series of metal contactor pins transversely and slidably extend. The pin body sections have bifurcated, barbed top end portions disposed above a top side of the connector base portion, and transversely enlarged bottom end portions disposed below the bottom side of the base portion. The base portion is secured to the circuit board by soldering the bottom pin end portions to the baord contact pads, with the slidable mounting of the pin body sections automatically compensating for board surface height variations in the region of the surface contact pads. An elongated clamping portion of the connector is snapped onto the base portion to downwardly force the ribbon end portion onto the upper pin ends, thereby locking the ribbon end portion in place on the connector and causing the barbed portions of the upper pin ends to upwardly pierce the ribbon insulation and be brought into conductive contact with its spaced series of embedded electrically conductive wires.

REFERENCES:
patent: 3964816 (1976-06-01), Narozny
patent: 4927372 (1990-05-01), Collier
patent: 4978308 (1990-12-01), Kaufman

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Space-saving insulation displacement type interconnect device fo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Space-saving insulation displacement type interconnect device fo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Space-saving insulation displacement type interconnect device fo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2201045

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.