Sound-suppressing structure with thermal relief

Acoustics – Sound-modifying means – Muffler – fluid conducting type

Patent

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Details

181222, 181290, 181293, G10K 1100

Patent

active

041065875

ABSTRACT:
Sound-suppressing structure comprising stacked acoustic panels wherein the inner high frequency panel is mounted for thermal expansion with respect to the outer low frequency panel. Slip joints eliminate the potential for thermal stresses, and a thermal expansion gap between the panels provides for additional relative thermal growth while reducing heat convection into the low frequency panel.

REFERENCES:
patent: 3850261 (1974-11-01), Hehmann
patent: 3948346 (1976-04-01), Schindler

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