Solventless, polyimide-modified epoxy composition

Details Solventless, polyimide-modified epoxy composition Solventless, polyimide-modified epoxy composition

1984-07-06

1985-12-10

Jacobs, Lewis T.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252514, 523400, 525423, 525430, H01B 102

Patent

active

045578605

ABSTRACT:
Adhesive compositions are disclosed which comprise: (a) an epoxy resin; (b) a soluble polyimide resin; and (c) a monoepoxy diluent. Such compositions are curable by using conventional epoxy curing agent(s). If desired, conductive adhesives of this type can be formed by blending the composition with a conductive filler component.

REFERENCES:
patent: 3637901 (1972-01-01), Bargain et al.
patent: 3663651 (1972-05-01), Trant
patent: 3763087 (1973-10-01), Holub et al.
patent: 3856752 (1974-12-01), Bateman et al.
patent: 3920768 (1975-11-01), Kwiatkowski
patent: 3998779 (1976-12-01), Baer
patent: 4118535 (1978-10-01), Banucci et al.
patent: 4212959 (1980-07-01), Fukami et al.
patent: 4237262 (1980-12-01), Jones
patent: 4418166 (1983-11-01), Chesney et al.
Lee et al.; Handbook of Epoxy Resins; McGraw-Hill Book Co.; 1967; pp. 13-7, 13-8.

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