Solventless hot melt process for the preparation of pressure sen

Details Solventless hot melt process for the preparation of pressure sen Solventless hot melt process for the preparation of pressure sen

1995-08-31

1999-06-22

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

222152, 222226, 4272084, 4273855, 427496, 427551, 427558, 427559, 427595, C08J 704

Patent

active

059141573

ABSTRACT:
The incorporation of a non-thermosettable phenolic tackifying resin surprisingly provides improved solvent free, hot melt processing of hydrocarbon elastomers with crosslinking promoters to form pressure sensitive adhesive tapes. The tapes advantageously have a desirable balance of the properties of resistance to slow rate peel and fast rate peel adhesion.

REFERENCES:
patent: 4588637 (1986-05-01), Chiu
patent: 4678794 (1987-07-01), Huddleston et al.
patent: 5242727 (1993-09-01), Briddell et al.
Rubbercon '77, "Delayed Action Peroxide Vulcanization Systems", Y.W. Chow and G.T. Knight, pp. 24.1-24.12. (No date avail.).
Rubbercon '77, "New Developments in Rubber-Bound Antioxidants", Gerald Scott, pp. 19/1-19/18. (No date avail.).
Rubber World, "Crosslinking plasticizers for injection molding", J. Edgar Lohr, Jr., et al., pp. 47-51, Oct. 1971.
Schenectady Chemicals Inc., Material Data Sheets for SP-1068, SP-1077, SP-553, SP-560, SP-6701, and CRJ-418 Resins. (No data avail.).

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