Solventless curable resin composition, in particular for the fab

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525507, 525508, 525533, 264257, 264258, 442175, 528 92, 528112, 528357, 528358, 528409, 528410, 528412, 528413, 528414, 528416, C08F 2000

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056141262

ABSTRACT:
The invention relates to a substantially solventless curable resin composition, in particular for the fabrication of prepregs, which contains more than 45% by weight of substances which are solid at ambient temperature at least or at lower temperature, and which, in addition to comprising customary modifiers, comprises solid epoxy resins or a mixture of liquid and solid epoxy resins, at least one initiator which is sensitive to UV radiation for the polymerisation of the epoxy resins and has the formula I ##STR1## wherein a and b are each independently of the other 1 or 2, R.sup.1 ist a .pi.-arene, R.sup.2 is a .pi.-arene, an indenyl anion or a cyclopentadienyl anion, [X].sup..crclbar. is an anion [LQ.sub.m ].sup..crclbar. or the anion of a partially fluorinated or perfluorinated aliphatic or aromatic sulfonic acid, L is B, P, As or Sb, Q is F, with the proviso that some of the radicals Q may also be hydroxyl groups, and m is the valency of L increased by one, and at least one further compound which contains one or more than one carboxyl group, which composition, by heating to a temperature in the range from 60.degree. to 140.degree. C., excluding UV light and without the addition of a solvent, is convertible into a liquid state, and, by cooling to a temperature not exceeding ambient temperature and excluding UV light, can be convened from said liquid state into a solid composition which is chemically substantially still unchanged and has a softening point of -3.degree. C. and higher, and which is tack-free or substantially tack-free at ambient temperature. Prepregs can be fabricated from these compositions in simple manner without the use of solvents.

REFERENCES:
patent: 4920182 (1990-04-01), Manser et al.
patent: 4963300 (1990-10-01), Meier et al.
patent: 5073438 (1991-12-01), Meier et al.
patent: 5130406 (1992-07-01), M uller et al.
patent: 5179179 (1993-01-01), M uller et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 5, Oct. 1984.

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