Coating processes – Centrifugal force utilized
Reexamination Certificate
2005-04-26
2005-04-26
Fiorilla, Chris (Department: 1734)
Coating processes
Centrifugal force utilized
C427S301000, C427S299000, C427S346000, C438S782000
Reexamination Certificate
active
06884462
ABSTRACT:
A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
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Koch George
Schwegman Lundberg Woessner & Kluth P.A.
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