Solvent free epoxy resin compositions containing substituted cya

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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528 89, 528 94, 528 98, 528102, 528111, 528123, C08L 6302

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active

055345654

ABSTRACT:
Epoxy resin compositions used in preparation of laminates for electronic applications are free of the solvents typically needed in current industrial practice. The use of certain mono-substituted dicyandiamides makes possible the elimination of such solvents since all of the components are soluble in epoxy resin to an extent which provides uniform properties in the cured laminates.

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Translated copy of Japan Kokai 61-223023.
May (J. Org. Chem) 12, 437-442, 443-445 (1947).
Curd (J. Chem. Soc., 1630-1636) (1948)).
Curd (J. Chem. Soc. 729-737 (1946)).

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