Solutions for controlled, selective etching of copper

Details Solutions for controlled, selective etching of copper Solutions for controlled, selective etching of copper

2003-12-03

2008-12-16

Tran, Binh X (Department: 1792)

Etching a substrate: processes

Nongaseous phase etching of substrate

Etching inorganic substrate

C216S046000, C252S079100, C438S750000, C438S751000

Reexamination Certificate

active

07465408

ABSTRACT:
Disclosed are methods and systems of etching copper containing materials so that they have smooth and/or planar surface. In this connection, the systems and methods employ two different solutions to accomplish the etching. The first solution oxidizes the surface of the copper containing material and forms a passivating film. The second solution removes the passivating film in a controlable manner.

REFERENCES:
patent: 5098533 (1992-03-01), Duke et al.
patent: 5100499 (1992-03-01), Douglas
patent: 5279702 (1994-01-01), Douglas
patent: 5318662 (1994-06-01), Douglas
patent: 5336363 (1994-08-01), Morita
patent: 5968847 (1999-10-01), Ye et al.
patent: 6008140 (1999-12-01), Ye et al.
patent: 6010603 (2000-01-01), Ye et al.
patent: 6261953 (2001-07-01), Uozumi
patent: 6355979 (2002-03-01), Tesauro et al.
patent: 6488862 (2002-12-01), Ye et al.
patent: 6489247 (2002-12-01), Ye et al.
patent: 6547843 (2003-04-01), Shimazu et al.
patent: 6589882 (2003-07-01), Andreas et al.
patent: 6594024 (2003-07-01), Singh et al.
patent: 6596638 (2003-07-01), Kondo et al.
patent: 6719920 (2004-04-01), Miller

Affiliated with

Also associated with

Rating

Solutions for controlled, selective etching of copper does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solutions for controlled, selective etching of copper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solutions for controlled, selective etching of copper will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4038485