Solutions for chemically polishing surfaces of copper and its al

Details Solutions for chemically polishing surfaces of copper and its al Solutions for chemically polishing surfaces of copper and its al

1975-12-08

1978-04-25

Pitlick, Harris A.

Compositions

Compositions containing a single chemical reactant or plural...

Organic reactant

134 3, 134 41, 156666, 156903, 252 792, 252 794, 252102, 252142, 423272, C23F 300, C23G 106, C09K 1306, C11D 708

Patent

active

040861767

ABSTRACT:
A solution for chemically polishing surfaces of copper and its alloys contains acid oxalates at a pH value of 3.0 - 5.0 in combination with hydrogen peroxide and one or more stabilizers and brighteners.

REFERENCES:
patent: 2211400 (1940-08-01), Wood
patent: 2428804 (1947-10-01), Terry
patent: 2894905 (1959-07-01), Bernard
patent: 3194768 (1965-07-01), Lindner et al.
patent: 3345217 (1967-10-01), Wollgien et al.
patent: 3367875 (1968-02-01), Sherer et al.
patent: 3537926 (1970-11-01), Fischer
patent: 3709824 (1973-01-01), Oda et al.
patent: 3770530 (1973-11-01), Fujimoto
patent: 3773577 (1973-11-01), Shibasaki et al.
patent: 3869401 (1975-03-01), Ernst
patent: 3905907 (1975-09-01), Shiga
patent: 3948703 (1976-04-01), Kushibe

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