Solution processing apparatus and solution processing method

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

Reexamination Certificate

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C205S133000, C204S198000, C204S212000, C204S22400M

Reexamination Certificate

active

06926817

ABSTRACT:
A plating apparatus includes a plating solution tank which stores a plating solution, a holder including an inner space to house a wafer and an opening for the wafer to be in contact with the plating solution, and a nitrogen supplying mechanism to supply nitrogen to the inner space of the holder.

REFERENCES:
patent: 6099702 (2000-08-01), Reid et al.
patent: 6156167 (2000-12-01), Patton et al.
patent: 6179982 (2001-01-01), Ting et al.
patent: 6309520 (2001-10-01), Woodruff et al.
patent: 6334937 (2002-01-01), Batz et al.
patent: 2002/0020622 (2002-02-01), Hanson et al.

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