Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal
Patent
1973-12-26
1976-01-20
Ozaki, G.
Metal treatment
Process of modifying or maintaining internal physical...
Chemical-heat removing or burning of metal
148172, 252 623GA, H01L 738
Patent
active
039335399
ABSTRACT:
The disclosure relates to a method and system for providing epitaxial solution growth of Group III-V compounds, one of which is gallium arsenide onto a substrate wherein the epitaxially grown layer is of uniform thickness over the substrate and the dopant is uniformly distributed throughout the epitaxially grown layer. This is accomplished, in accordance with one embodiment of the invention, by passing a hydrogen stream containing arsenic chloride vapor over the surface of a gallium arsenide-gallium melt wherein the substrate is immersed. The arsenic chloride is reduced to elemental arsenic and HCl, the latter reacting with the gallium to form gallium chloride which is volatile at the operating temperatures and is removed from the system. A saturated system of gallium arsenide in gallium is produced, some of the excess gallium arsenide depositing epitaxially on the substrate in solution. Any dopant would be placed in the melt and deposit along with the gallium arsenide on the substrate. The substrate is continually rotated to maintain substantially constant temperatures at the substrate and the immediately surrounding region.
In accordance with a second embodiment of the invention, the substrate is lowered into a gallium melt saturated with or having an excess of gallium arsenide. When the substrate reaches the melt temperature, it is then externally cooled and maintained at a constant temperature with rotation in the melt, the substrate temperature being slightly below the melt temperature. Gallium arsenide will thus deposit from the melt onto the substrate, the gallium arsenide being continually replenished in the melt. A dopant can also be placed in the melt. The temperature differential between substrate and melt is maintained constant along the entire substrate.
REFERENCES:
patent: 3546032 (1970-12-01), Basart
patent: 3647578 (1972-03-01), Barnett et al.
patent: 3677836 (1972-07-01), Lorenz
patent: 3755013 (1973-08-01), Hollan
Comfort James T.
Honeycutt Gary C.
Levine Harold
Ozaki G.
Texas Instruments Incorporated
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