Solution for electroplating a gold-copper-cadmium alloy

Details Solution for electroplating a gold-copper-cadmium alloy Solution for electroplating a gold-copper-cadmium alloy

1984-02-06

1984-12-04

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 362

Patent

active

044862750

ABSTRACT:
A bath and method for electrodepositing gold-copper-cadmium alloys. The electroplating solution contains cadmium ions complexed by a soluble hydroxyalkyl diacetate complexing agent and, in addition, a brightener in the form of a phosphoric ester of a chain of ethylene oxides bonded to an alkyl group, and/or a surfactant in the form of one or a mixture of more than one amidopropyldimethylaminoxides of fatty acids.

REFERENCES:
patent: 3056733 (1962-10-01), Heilmann
patent: 3586611 (1971-06-01), Heilmann
patent: 4179344 (1979-12-01), Thomson
patent: 4309256 (1982-01-01), Aliprandini

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