Solution for direct copper writing

Details Solution for direct copper writing Solution for direct copper writing

1991-08-09

1993-01-05

Bell, Mark L.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C09D 1800

Patent

active

051767449

ABSTRACT:
Improved method and solutions for copper direct writing, particularly laser-induced direct writing, involving copper formate precursor solutions that contain a crystallization-inhibiting agent. The agent is selected from glycerol, citric acid, malic acid, malonic acid and glycine.

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Appl. Phys. Lett. 56 (10), 1990, Muller, pp. 904-906.
Applied Surface Science (46), 1990, Muller, pp. 143-147.
J. Mater Res., 1991, Lin et al., vol. 6, No. 4, pp. 760-765.
Appl. Phys. B28, 1982, Gerassimov, p. 266.
Research Disclosure 26162, 1986.
Research Disclosure 29367, 1988.
Research Disclosure 2987, 1989.

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