Solution for coating non-conductors with conductive polymers and

Details Solution for coating non-conductors with conductive polymers and Solution for coating non-conductors with conductive polymers and

1995-04-11

1997-01-28

Bell, Bruce F.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

205160, 205162, 205164, 205166, 205920, 205925, C25D 554, C25D 556, C25D 700

Patent

active

055974716

DESCRIPTION:

BRIEF SUMMARY
This application is a 371 of PCT/DE93/00780 filed Aug. 20, 1993.


BACKGROUND OF THE INVENTION

1. Field of the Invention
The invention relates to a solution as well as to a process for metallizing non-conductors using conductive polymers.
It is known to process non-conductive surfaces in the following steps: so that an oxidation agent is adsorbed or created on the non-conductive surface. can be converted through oxidation into a conductive polymer, and at least one water-soluble polymer.
2. Discussion of the Prior Art
In DE 38 06 884 C1 and EP 0 413 109 A2, processes of this type using conductive polymers for the metallization of non-conductors are described. What is crucial in both processes is that the otherwise necessary intermediate step of chemical metallization may be omitted and that electroplating is achieved in a shorter process.
The processes described above have technical disadvantages, however. According to DE 38 06 884 C1, the monomer needed to produce the conductive polymer is adsorbed on brownstone, and the acid required for polymerization is not added until after this has occurred. This sequence results in the quantity of monomer being limited both by its adsorption capacity on brownstone and by the quantity of brownstone on the non-conductive surface. This can lead either to insufficient polymerization through oxidation of the monomer or to over-oxidation, so that the requisite process reliability is not guaranteed.
In the process described in DE 38 06 884 C1, the post-treatment step with acid constitutes the essential step in polymerizing the monomer into the conductive polymer, because an acid is needed along with the oxidation agent for the chemical expression of a conductive polymer. This sequence of steps results in a longer process. Furthermore, in this process, volatile solvents are used together with the volatile pyrrole. This pollutes the environment and impairs occupational safety, because in order to achieve adequate polymerization a high concentration of the monomer must be used in the solution, meaning that solubilizers must be added to the solution when water is used as the preferred solvent.
In contrast, the process according to EP 0 413 109 A2 uses already finished polyaniline, which is applied by coating to the non-conductive surface. In addition to the requisite prior synthesis of the polyaniline, the selectivity of the process and the not always adequate adhesion of the polymer layer to the non-conductive surface constitute significant problems of this process.
In DE 39 39 676 A1 and EP 0 457 180 A2, a process for metallization is described which is based on the process steps:
This process does not use the oxidative spectrum of the permanganate to produce sufficient oxidation agent; an additional pre-treatment step with organic solvents is required. The use of N-methylpyrrolidone in the swelling step is disadvantageous because of the limited retention time of the swelling bath, since the compound has only low acid stability. The temperatures specified in both documents for the pyrrolic polymerization bath are not optimal for an even conductive layer. In addition, the volatility of the solvent and the pyrrole used in these processes also presents a problem, because their emission from processing equipment pollutes the environment and reduces occupational safety.
In U.S. Pat. No. 4,617,228 a process is described for the impregnation of porous substrate materials, e.g., glass fiber fabric, in which a liquid pyrrole compound and a solution of a strong oxidation agent are brought into contact sequentially with the substrate material in the presence of a non-nucleophilic anion. Conductivity in the carrier material is attained through the precipitated conductive layer of conductive polymer. Neither further electroplating metallization of the conductive polymer layer nor electrical resistance values of the conductive polymer layer are disclosed, so that there is no way to tell whether a sufficient electroplating capability even exists.
In JP 63 125696 A, the plating of non-cond

REFERENCES:
patent: 4617228 (1986-10-01), Newman et al.
patent: 4959162 (1990-09-01), Armes et al.
patent: 5194313 (1993-03-01), Hupe et al.
patent: 5415762 (1995-05-01), Allardyce et al.
Abstract of JP2240139 A. Published Sep. 25, 1990.

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