Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Patent
1993-12-03
1995-04-11
Beck, Shrive
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
427581, 427595, 427596, 427301, 427437, B05D 118, B05D 306
Patent
active
054056560
ABSTRACT:
The present invention relates to a solution for catalytic treatment, which is effective for applying a catalyst-metal onto the surface of a substrate, which can provide a film having excellent properties such as adhesion, precision and selectivity through electroless plating or the like, and which does not cause a premature and undesirable decomposition in a bath. The solution for catalytic treatment comprises a catalyst-metal in the form of ions, which permits the deposition of the metal serving as a catalyst on a substrate by applying the solution onto the surface of the substrate and then irradiating the substrate with light rays. The present invention also relates to a method of applying a catalyst onto a substrate and a method of forming an electrical conductor in which such a solution for catalytic treatment is employed.
REFERENCES:
patent: 3772056 (1973-11-01), Polichette
patent: 4001470 (1977-01-01), Schulze-Berge
patent: 4151311 (1979-04-01), Feldstein
patent: 4153746 (1979-05-01), Kilthan
patent: 4417948 (1983-11-01), Mayne-Banton
patent: 4511595 (1985-04-01), Inoue
patent: 4511597 (1985-04-01), Teng
patent: 4574095 (1986-03-01), Baum et al.
patent: 4717421 (1988-01-01), Frisby
patent: 4863758 (1989-09-01), Rhodenizer
patent: 4917939 (1990-04-01), Matsuda
patent: 4986848 (1991-01-01), Yamamoto
Mance & Waldo, Interactions of Electroless Catalysts with Photo-Oxidized Polymer Surfaces, Nov. 1988, J. Electrochem Soc. pp. 2729-2735.
Paunovic, Photochemical Selective Activation for Electroless Metal Deposition on Nonconductors, Sep. 1980, J. Electrochem Soc.
Baum, Photochemically Generated Gold Catalyst for Selective Electroless Plating of Copper, Jan. 1990, J. Electrochem. Soc.
Research Disclosure 31993, Nov. 1990, No. 319.
Julius Grant "Hackh's Chemical Dictionary" 4th ed. McGraw-Hill Co. 1969, pp. 699-700.
Irie Masahiro
Ishikawa Futoshi
Kondo Koji
Beck Shrive
Dang Vi Duong
Nippondenso Co. Ltd.
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