Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2006-06-06
2006-06-06
Webb, Gregory (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000, C510S254000, C510S255000, C510S499000, C134S002000, C134S003000, C438S692000
Reexamination Certificate
active
07056872
ABSTRACT:
Cleaning solutions for removing photoresist resins remaining on the underlying layer patterns formed by photolithography process using the photoresist patterns as etching mask. The cleaning solution for removing photoresist comprises H2O as solvent, amine compounds, hydrazine hydrate, transition metal-removing material and alkali metal-removing material. Photoresist coated on the top portion of underlying layers can be rapidly and effectively removed by the disclosed cleaning solution. In addition, the cleaning solution is environment-friendly because H2O is used as the solvent, and has little effect on metal layers when underlying layers are formed of metals.
REFERENCES:
patent: 3919100 (1975-11-01), Brindisi et al.
patent: 5981454 (1999-11-01), Small
patent: 6534458 (2003-03-01), Kakizawa et al.
patent: 6752878 (2004-06-01), Montano et al.
patent: 1020010067436 (2001-07-01), None
Chung Jae Chang
Lee Geun Su
Oh Kee Joon
Shin Ki Soo
Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
Webb Gregory
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