Solution applying apparatus and method

Details Solution applying apparatus and method Solution applying apparatus and method

2007-09-18

2007-09-18

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

Reexamination Certificate

active

10976879

ABSTRACT:
In etching using an etching solution, irradiating ultraviolet light is irradiated into a resist patterned on an etching substrate or a film formed on the etching substrate and then an etching solution is applied to the etching substrate while rotating the etching substrate. Also, ozone water is applied in contact with the resist and then an etching solution is applied to the etching substrate while rotating the etching substrate. In crystallization using a metal element such as nickel for promoting crystallization of silicon, irradiating ultraviolet light is irradiated into a resist patterned on an substrate or a film formed on the substrate and then a nickel solution is applied to the substrate while rotating the substrate. Also, ozone water is applied in contact with the resist and then the nickel solution is applied to the substrate while rotating the substrate.

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