Solid state pressure transducer of the leaf spring type and batc

Electrical resistors – Strain gauge type

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Details

29576R, 29580, 29592, 296105G, 338 4, 338 42, 357 26, G01L 122

Patent

active

040217663

ABSTRACT:
Solid state leaf spring pressure transducers are fabricated by batch photolithographic and etching techniques from a monocrystalline material, such as silicon. The leaf spring structures include elongated gaps separating adjacent leaf spring leg portions from each other and from a surrounding support structure defined by the intervening region of the wafer disposed inbetween adjacent leaf spring structures. An array of fluid tight partitions are sealed at their outer peripheries to the adjacent support structure. Compliant portions of the partitions are individually coupled to individual ones of the spring structures for movement therewith. In one embodiment, the gaps between adjacent leg portions of the individual springs and the surrounding support structure are sealed by a fluid tight web deposited over the major face of the wafer containing the batch of spring structures. In another embodiment, a web or membrane which is deposited or formed over the major face of the wafer has corrugated diaphragms formed therein. In another embodiment, a membrane is deposited over the major face of the wafer containing the batch of spring structures. In another embodiment the partitioning structure comprises a second wafer sealed over the first wafer.

REFERENCES:
patent: 3093806 (1963-06-01), Gutterman
patent: 3328653 (1967-06-01), Wolf, Jr.
patent: 3417361 (1968-12-01), Heller et al.
patent: 3757414 (1973-09-01), Keller
patent: 3820401 (1974-06-01), Lewis
patent: 3853650 (1974-12-01), Hartlaub

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