Solid-state imaging device having temperature sensor

Details Solid-state imaging device having temperature sensor Solid-state imaging device having temperature sensor

1994-07-21

1996-04-16

Razavi, Michael T.

Television

Camera, system and detail

Combined image signal generator and general image signal...

348207, 348294, H04N 964, H04N 5335

Patent

active

055087400

ABSTRACT:
The solid state image sensor comprises a chip in a package. A image sensor is formed in the chip. The package has a package main body, a light receiving glass plate fixed to the package main body, and a buffer member arranged between the package main body and light receiving glass plate. The buffer member is fixed to the light receiving glass plate and to the package main body. The thermal expansion coefficient of the buffer member is substantially equal to that of the light receiving glass plate, so that the light receiving plate is fixed to the package main body even though the temperature of the imaging device changes. Therefore, the adhesion between the package main body and the light receiving glass plate and the airtightness in the package are maintained.

REFERENCES:
patent: 4402185 (1983-09-01), Perchak
patent: 4551760 (1985-11-01), Bendell
patent: 4594613 (1986-06-01), Shinbori et al.
patent: 4739409 (1988-04-01), Baumeister
patent: 5272535 (1993-12-01), Elabd

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