Solid-state imaging device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Reexamination Certificate

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Details

C257S072000, C257S089000, C257S434000, C257S460000, C257S462000, C438S073000, C438S075000

Reexamination Certificate

active

06930327

ABSTRACT:
There are provided a semiconductor substrate101on which solid-state imaging devices are formed, and a translucent member201provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate101to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate101.

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