Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2006-07-11
2006-07-11
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S064000, C438S068000, C438S073000
Reexamination Certificate
active
07074638
ABSTRACT:
It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
REFERENCES:
patent: 4357557 (1982-11-01), Inohara et al.
patent: 5436492 (1995-06-01), Yamanaka
patent: 5641713 (1997-06-01), Kyle
patent: 6342406 (2002-01-01), Glenn et al.
patent: 6407381 (2002-06-01), Glenn et al.
patent: 2002/0019069 (2002-02-01), Wada
patent: 1 376 705 (2004-01-01), None
patent: 63029974 (1988-02-01), None
patent: 05110960 (1993-04-01), None
patent: 7-202152 (1995-08-01), None
patent: 2002-329850 (2002-11-01), None
patent: WO-01/43202 (2001-06-01), None
patent: WO-03/019653 (2003-03-01), None
Hosaka Shunichi
Maeda Hiroshi
Negishi Yoshihisa
Nishida Kazuhiro
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