Solid-state imaging device and manufacturing method thereof

Details Solid-state imaging device and manufacturing method thereof Solid-state imaging device and manufacturing method thereof

2005-03-15

2005-03-15

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Heterojunction device

Light responsive structure

C257S187000, C257S203000, C257S221000, C257S291000, C257S292000, C257S293000, C257S433000, C257S461000, C257S462000, C257S929000

Reexamination Certificate

active

06867438

ABSTRACT:
There is a demand of a solid-state imaging device capable of being driven at a high speed and in which the shading of sensitivity and illuminance defect can be prevented from being caused. A solid-state imaging device (20) comprises a light-receiving sensor section disposed on the surface layer portion of a substrate (21) for performing a photoelectric conversion, a charge transfer section for transferring a signal charge read out from the light-receiving sensor section, a transfer electrode (27) (28) made of polysilicon formed on a substrate (21) at a position approximately above the charge transfer section through an insulating film (26), and an interconnection made of polysilicon and interconnected to the transfer electrode (27) (28). At least one of the polysilicon transfer electrode (27)(28) and the interconnection is formed on a polysilicon layer (27a) (28a) by selectively depositing a high-melting point metal having a resistance value lower than that of polysilicon. Also, there is provided a solid-state imaging device in which a fluctuation of a work function of the transfer electrode can be avoided and a manufacturing method thereof. The solid-state imaging device (10) comprises a buffer layer (1) containing a metal silicide layer (16) is formed between the transfer electrodes (3), (4) and a shunt interconnection layer (7) formed of a metal layer.

REFERENCES:
patent: 5194751 (1993-03-01), Yonemoto et al.
patent: 5286669 (1994-02-01), Maeda et al.
patent: 5506429 (1996-04-01), Tanaka et al.
patent: 6504188 (2003-01-01), Maruyama et al.
Orihara et al., New Shunt Wiring Technologies for High Performance HDTV CCD Image Sensors, Dec. 13-16, 1992, Electron Devices Meeting, 1992. Technical Digest., International, 105-108□□.

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