Solid state imaging device

Photography – Body examination photography – Skin ridge pattern

Reexamination Certificate

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Reexamination Certificate

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07809255

ABSTRACT:
The solid-state imaging device includes a semiconductor substrate and a light receiving portion. On the back surface of the semiconductor substrate a contact surface is provided. The solid-state imaging device photoelectrically converts, in the semiconductor substrate, light transmitted through the object to be imaged in contact with the contact surface, and receives the electric charge generated by the photoelectric conversion with the light receiving portion, to thereby acquire the image of the object to be imaged. The contact surface is a rough surface.

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Chinese Patent Office issued a Chinese Office Action dated Jan. 23, 2009, Application No. 200710096043.4.

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