Solid state imaging apparatus in which a solid state imaging dev

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

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Details

257723, 257680, 358 98, H01L 2312

Patent

active

052201988

ABSTRACT:
A solid state imaging apparatus which can be made small in the contour is formed of a solid state imaging device chip provided with pad electrodes formed near a photoelectrically converting part, an interal connecting substrate bent so that a plurality of surfaces not on the same plane as this solid state imaging device chip may be formed and face-bonded and connected with the pad electrodes of this solid state imaging device chip through bumping members and electronic parts fitted on this connecting substrate and functionally connected to the solid state imaging device chip.

REFERENCES:
patent: 4777524 (1988-10-01), Nakajimo et al.
patent: 4832003 (1989-05-01), Yabe
patent: 4868646 (1989-09-01), Tsuji

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