Solid-state imaging apparatus and manufacturing method thereof

Details Solid-state imaging apparatus and manufacturing method thereof Solid-state imaging apparatus and manufacturing method thereof

2006-03-28

2006-03-28

Kang, Donghee (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S431000, C257S432000, C257S434000, C438S064000, C438S065000

Reexamination Certificate

active

07019375

ABSTRACT:
A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion1C, and a light-transmitting member is attached so as to cover the through-opening portion1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

REFERENCES:
patent: 6384473 (2002-05-01), Peterson et al.
patent: 2001-245186 (2001-09-01), None

Affiliated with

Also associated with

Rating

Solid-state imaging apparatus and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solid-state imaging apparatus and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid-state imaging apparatus and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3556810