Solid-state imaging apparatus and manufacturing method thereof

Details Solid-state imaging apparatus and manufacturing method thereof Solid-state imaging apparatus and manufacturing method thereof

2006-04-18

2006-04-18

Ullah, Akm Enayet (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S092000, C257S434000, C257S680000, C438S116000

Reexamination Certificate

active

07029186

ABSTRACT:
A light-transmitting member is previously formed, and then integrally molded during a process of molding a structure member. A solid-state imaging apparatus has: the structure member configured by an insulating resin and having a through-opening portion; a wiring portion which is formed on the surface of the structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member which is placed to cover the through-opening portion with being separated from the solid-state imaging element by a predetermined distance The light-transmitting member is configured by a plate-like member made of a material which is smaller in coefficient of linear expansion than the insulating resin, and integrally molded with the structure member to be embedded at a peripheral portion into the structure member.

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patent: 2001-245186 (2001-09-01), None

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