Solid-state imaging apparatus and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S431000, C257S432000, C257S434000, C438S048000, C438S064000, C438S065000, C361S736000, C361S737000

Reexamination Certificate

active

06949808

ABSTRACT:
A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion1C, and a light-transmitting member is attached so as to cover the through-opening portion1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

REFERENCES:
patent: 6384473 (2002-05-01), Peterson et al.
patent: 2001-245186 (2001-09-01), None

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