Solid-state image sensor and a method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

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257232, 257248, H01L 29768, H01L 27148

Patent

active

061005533

ABSTRACT:
A solid-state image sensor and a fabricating method thereof in which poly gates in a horizontal charge coupled device (hereinafter referred to as HCCD) are made to have different lengths to omit a barrier ion implanting process step, thus simplifying the entire process and maximizing the charge-transferring efficiency are disclosed, the solid-state image sensor having an HCCD and VCCDs including a well region of a second conductivity type formed in a semiconductor substrate of a first conductivity type; a HCCD of the first conductivity type formed on the well region of the second conductivity type; and a plurality of polygate electrodes having sequentially different lengths repeatedly formed on the semiconductor substrate.

REFERENCES:
patent: 5289022 (1994-02-01), Iizuka et al.
patent: 5406101 (1995-04-01), Park
patent: 5760430 (1998-06-01), Kato
"A 1-Megapixel, Progressive-Scan Image Sensor with Antiblooming Control and Lag-Free Operation," IEEE Transactions on Electron Devices, vol. 38, No. 5, May 1991, pp. 981-988.

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