Solid state image sensing device

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357 73, 357 80, 357 32, 357 30, H01L 2328

Patent

active

050687131

ABSTRACT:
A solid state image sensing device including a transparent support, at least one transparent substrate chip fixed on the support by a fixing agent, at least one photoelectric converting element on the transparent substrate chip and mold material for covering at least the exposed surfaces of the transparent substrate chip, in which the refractive index of the mold material is higher than or equal to that of the transparent substrate chip. The transparent substrate chips can be arranged in a line which is equal in optical and electrical continuity to a single-line solid state image sensing device of high precision and reliability.

REFERENCES:
patent: 4654536 (1987-03-01), Saito et al.
patent: 4675535 (1987-06-01), Tsunekawa et al.
patent: 4710797 (1987-12-01), Tanaka
patent: 4877306 (1989-10-01), Kar

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