Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1997-01-15
2000-06-06
Chaudhuri, Olik
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438 69, 438121, H01L 2160
Patent
active
060717602
ABSTRACT:
There is provided a solid-state image sensing device, having: a semiconductor chip having an effective area used for image sensing; a sealing plate provided opposedly to the semiconductor chip; inner leads arranged between an outside portion of the effective area of the semiconductor chip and the sealing plate, and connected electrically to the semiconductor chip; and a sealant in contact with the end portion and the side face on the effective area side of the inner leads.
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patent: 5321204 (1994-06-01), Ko
patent: 5357056 (1994-10-01), Nagano
patent: 5534725 (1996-07-01), Hur
patent: 5753857 (1998-05-01), Choi
patent: 5773323 (1998-06-01), Hur
patent: 5786589 (1998-07-01), Segawa et al.
patent: 5952714 (1999-09-01), Sano et al.
Chambliss Alonzo
Chaudhuri Olik
Sony Corporation
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